Advanced Heat Spreader Technology for GaN MMICs
ThermAvant's Phase I SBIR proposal entitled "Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)" has been notified of its successful offer.
In this pending Phase I effort, ThermAvant aims to design, fabricate and empirically demonstrate high-thermal conductivity heat spreaders for thermal management of high power GaN Power Amplifiers (PAs) on advanced Navy platforms. Innovations to be designed and tested include miniaturization of two-phase heat spreader geometries and the ability to manufacture such heat spreaders at required sizes and materials to survive extreme temperatures required by major defense contractors’ PA assembly processes. For agencies and major defense contractors, this Phase I has the potential to add a new technology to use in removing the thermal constraints facing their radar, Electronic Warfare (EW), and commercial radar/RF systems.