ThermAvant Technologies Will More Than Quadruple Space To Meet Growing Demand for Its Thermal Management Solutions

Fueled by growing demand for its thermal management hardware and services, ThermAvant Technologies will more than quadruple its engineering and manufacturing space.  In May, the firm is opening a 33,000-square-foot facility at 2508 Paris Road in Columbia. 

 Founded in 2007, ThermAvant is expanding rapidly as aero-defense and technology customers adopt its oscillating heat pipe technology into their platforms. Today, ThermAvant serves the avionics, spacecraft, computer, radar, and telecommunications industries. The firm has also been engaged by leading agencies, including the Air Force Research Laboratory (AFRL), NASA, National Science Foundation, Army Research Laboratory, Office of Naval Research, and the Missile Defense Agency.

 “After nearly a decade of sustained R&D, we started selling our first commercial products in 2017. Now, we are scaling up engineering and production as quickly as we can,” says ThermAvant CEO Joe Boswell. 

 “There has been a decline in Midwest manufacturing,” he adds.  “It’s encouraging to buck that trend with the opening of our new facility.” 

 In 2018, ThermAvant received funding from Missouri Technology Corporation (MTC), a public-private partnership created by the Missouri General Assembly to promote entrepreneurship and foster the growth of new and emerging high-tech companies.  “People generally associate technological innovation with Silicon Valley, New York, or Boston,” says Bill Vega, interim executive director of MTC.  “But, as ThermAvant demonstrates, there are exciting developments taking place in the heartland.”

 In that same year, ThermAvant and the AFRL were selected as an R&D 100 Award winner for the development of “Oscillating Heat Pipes for High-Power Electronics Thermal Management.” An independent panel of judges deemed this work as “one of the 100 most technologically significant new products of the year.”

 ThermAvant’s grand opening reception will take place at the new headquarters on May 2nd.  “We look forward to offering tours to attendees and familiarizing local community members with our products, our history with the University of Missouri here in Columbia, and our future plans,” says Mr. Boswell.  “In our opinion, prospects are strong for our small but expanding business, and this should benefit our local community as well.”  

ThermAvant Engineers Present Findings at IMAPS Thermal Management

Discuss Thermal Performance of Flat-Plate Oscillating Heat Pipes

Four ThermAvant engineers recently discussed their research on flat-plate oscillating heat pipes at the Thermal Management workshop, an annual event sponsored by the International Microelectronics Assembly and Packaging Society (IMAPS).


ThermAvant’s presenters included co-founder and CEO Joe Boswell, senior engineer Dr. Corey Wilson, VP of engineering Daniel Pounds, and consultant Dr. Bruce Drolen.  They explained that most uses of oscillating heat pipes (OHPs) involve “flat-plates” in opto-electronics thermal management, but that demand is growing for uses in “3D” complex geometries or structures.  


The current “limits” model captures only linear, straight micro-channel phenomena, so ThermAvant decided to measure the temperature rise inside a flat-plate OHP before and after making out-of-plane turns or bends.  


Initial results confirmed small effect of turns or bends on temperature, but the presenters recommend higher fidelity testing of larger sample sizes.  They concluded that future upgrades to the “limits” model should encompass gravity impacts combined with turns and bends. 


ThermAvant CEO Discusses Thermal Management System Techniques at Battery Safety Conference

ThermAvant Technologies co-founder and CEO Joe Boswell co-moderated a roundtable discussion entitled “innovative thermal management system techniques” during the ninth annual Battery Safety Conference.  William Q. Walker, PhD, aerospace technologist at NASA Johnson Space Center, served as lead moderator. During the roundtable, representatives from aerospace, defense, technology firms as well as government agencies discussed the safety challenges and potential solutions when integrating high energy lithium-ion batteries (LiBs) into wide ranging fields of use.

As co-moderator, Joe described recent LiB applications where Oscillating Heat Pipes (OHPs) are being implemented into packages to better control cell temperatures in high charge and discharge applications. Further discussions were held about how two-phase fluids inside OHPs can be tuned to stop transferring heat; and isolate defective or abused cells that go into thermal runaway.  Attendees also shared their experiences of how different LiB packaging materials and thermal management techniques imposed tradeoffs between safety, performance and cost.  Finally, participants talked about different methods for inducing thermal runaway in LiB packages and how to design experiments such that the resultant information can be used to continue to improve LiB safety in their systems or applications.

Held on October 30-31, 2018, in Arlington, VA, Battery Safety brought academic, government and industry experts into a dialogue about integrating and implementing LiB safety to meet ever-increasing energy demands. Lean more about Battery Safety at

If interested in learning more about how ThermAvant works with government and private-party customers to improve the safety and power density of their lithium-ion batteries, please contact


ThermAvant Technologies Selected as Finalist for 2018 R&D 100 Awards

Firm Honored for Innovation in Oscillating Heat Pipes

R&D Magazine has named ThermAvant Technologies as a finalist for the 2018 R&D 100 Awards, which honor the top revolutionary technologies of the past year.   ThermAvant developed the qualifying product, oscillating heat pipes for high-power electronics thermal management, with support from the United States Air Force Research Laboratory and the Space Vehicles Directorate (AFRL/RV).   

ThermAvant has long specialized in oscillating heat pipes (OHPs), which use thermally driven, two-phase fluid flow to rapidly transfer heat between heat sources and heat sinks.   OHPs have a variety of applications, including CPU, GPU, and microchip cooling; energy recovery heat exchangers; heat spreaders for RF devices; heat sinks for optical equipment; and LED cooling, to name a few.  These applications, in turn, serve a wide range of industries, including aviation, spacecraft, IT, energy storage, healthcare, and more.

The winners of the R&D 100 awards will be announced on November 16th, 2018.   


ThermAvant Technologies selected for Air Force Phase I SBIR

Passive-Solid State Power Amplifier Thermal Management

ThermAvant's proposal for Passive Solid-State Power Amplifier Thermal Management submitted under SBIR Topic Number AF161-086 has been selected for award by the Department of Defense and the Air Force Research Laboratory. The pending award aims to develop low-cost, low-mass thermal management solutions to address the high heat flux and temperature of next generation GaN power amplifiers or phased arrays. The proposed heat transfer technology will have use aboard DoD satellites and be equally applicable for use on commercial satellites, as well as many other terrestrial electronics.

ThermAvant Technologies selected for Army Phase I SBIR

Lightweight Heat Exchangers for Man-Portable Battery Recharging System

ThermAvant's Phase I proposal, entitled “Development of Lightweight Heat Exchangers for Man-Portable Battery Recharging System” submitted to the Army Small Business Innovation Research (SBIR) Program has been competitively selected for negotiation and possible award. 

ThermAvant aims to develop and demonstrate compact, lightweight, and ultra-low thermal resistance air-cooled heat exchanger(s) for man-portable thermoelectric battery recharging systems. This research effort intends to not only prove prototypes' outstanding thermal performance prototypes but also result in designs for easy transport, high durability, and low-cost, high-volume manufacture. While the initial application is for charging hand-held thermoelectrics, the to-be-proven innovations can be applied to industrial waste heat systems, solar thermal power generation, vehicle electronics thermal management, and even the cooling of satellite payloads.

ThermAvant Technologies selected for Navy Phase I SBIR

Advanced Heat Spreader Technology for GaN MMICs

ThermAvant's Phase I SBIR proposal entitled "Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)" has been notified of its successful offer.

In this pending Phase I effort, ThermAvant aims to design, fabricate and empirically demonstrate high-thermal conductivity heat spreaders for thermal management of high power GaN Power Amplifiers (PAs) on advanced Navy platforms. Innovations to be designed and tested include miniaturization of two-phase heat spreader geometries and the ability to manufacture such heat spreaders at required sizes and materials to survive extreme temperatures required by major defense contractors’ PA assembly processes. For agencies and major defense contractors, this Phase I has the potential to add a new technology to use in removing the thermal constraints facing their radar, Electronic Warfare (EW), and commercial radar/RF systems.