OSCILLATING HEAT PIPE

Radiators

Radiators are the rejection component of a spacecraft’s thermal control system where waste heat from onboard electronics, power-energy systems, RF devices, sensors, life support and other payloads is expelled.

ThermAvant Technologies’ OHP-embedded radiators are designed as simple 2-D or complex 3-D form factors. OHPs can be used as a purely thermal solution (e.g., thin, long-distance straps bonded to the spacecraft’s structural panels), or they can be designed into the structural panels as a multifunctional solution. ThermAvant Technologies has even developed deployable OHPs.

Commercial and defense satellite makers are increasingly transitioning to OHP-based radiators for their next-generation spacecraft to optimize tradeoffs of size, weight, power and cost – as well as reduced complexity of integration.

Commercial Space • Defense Spacecraft

Oscillating heat pipe radiator system integrated into satellite bus structure for deep space thermal rejection.

OHP Radiator Product Gallery

The products below show customized solutions with proprietary details removed.

Small satellite radiator panel with iso-grid backing for structural rigidity and integrated thermal rejection.
Smallsat Radiator
  • Iso-grid for structural rigidity

  • Example 6U satellite configuration

  • Satellite structure becomes heat rejection surfaces

Structural spacecraft radiator baseplate with custom surface finish and direct PCB mounting features.
Structural Spacecraft Radiator Baseplate
  • Custom finishes for space environment

  • Direct PCB mounting features

Meter-scale oscillating heat pipe radiator panel with high-tolerance features and multi-device heat load routing.
Meter Scale Spacecraft Radiator
  • High-tolerance mechanic features

  • Complex OHP channel routing for spreading heat from multiple devices of varying heat loads across a meter+ distances

Flexible 2D and 3D oscillating heat pipe radiator strap for spacecraft thermal management across wide heat flux ranges.
2- and 3-D Radiator Strap
  • Typically sized from 0.2m to 1.5m  in length with widths from <0.1m to >0.2m and thicknesses from 1mm to 5mm.

  • Heat loads vary fro <10W to >1 kW

  • Heat fluxes vary from <1W/cm2 to >100W/cm2

Lightweight matte black oscillating heat pipe radiator panel with central boss for electronic payload thermal rejection

Simple OHP Radiator

Under a series of NASA-funded SBIR efforts, ThermAvant Technologies developed high-efficiency, thin, and lightweight OHP-embedded radiators for medium- and high-heat flux next-generation payloads.  

In this spacecraft sidewall (or panel) radiator demonstrator, ThermAvant Technologies and NASA developed an approx. 500mm x 500mm x 1-4mm thick OHP-embedded radiator for environmental testing, including vacuum chamber testing (hence the matte black, high absorptivity coating for IR imaging) and variable gravity testing (0-degrees horizontal, 45-degrees vertical and 90-degree vertical).

Notably, ThermAvant Technologies designed lightweighting features so that the OHP-radiator’s effective density was 1.6 g/cm3. – 40% lighter than solid Al.

In operation, an electronics chassis attaches to the OHP-embedded radiator’s central boss (uncoated area, approx. 200mmx200mm) which rejects between 100 and 200W, with nominal operation at 150W.  However, the OHP-embedded radiator is designed to handle >1000W of heat load, though not required for this demonstrator due to relatively weak radiative rejection boundary.

As a result of its 9x higher conductance and lower density, the OHP radiator enables +14x higher in specific thermal conductance (W/K-g) compared to a solid Aluminum radiator – and can do so in range of gravity fields or transient heat loads.

Simple OHP Radiator vs. Alternatives

Thermal simulation comparing aluminum oscillating heat pipe radiator and solid aluminum under 150 W load showing improved heat spreading in OHP design.
Aluminum OHP Solid Al
Thermal performance 2 °C per 150 W 18 °C per 150 W
9x worse than OHP
Effective Density 1.6 g/cm³
Al 6061 T4 w. Selective Coating
2.7 g/cm³
1.7x worse than OHP
Shape & size • Al 6061 T4 sized to approx. 19" × 19" × 0.04–0.16" thick, note variable thickness in photo above (available in multiple coatings, platings or films).
• Al OHP typ. has 5% less stiffness and 5% higher modal frequencies than solid Al – utilized thicker cross-sections at interfaces with enclosure and larger spacecraft bus structure.
Temperature range -20 °C up to +100 °C
Heritage or maturity-level • +1,000 on-orbit (or delivered for launch) OHP spacecraft radiators deployed as of mid-2025 (TRL 9).
• Qualified thru MIL-STD vacuum chamber testing, thermal cycling, vibration, shock and pressure cycling for both launch and on-orbit reliability.
Complex oscillating heat pipe radiator panel for lunar rover with variable thickness and high-emissivity coating for >1kW thermal rejection.

350mm x 800mm x 3mm at thinnest center and 12mm at thickest edges

Complex OHP Radiator Example

For this lunar surface rover application, ThermAvant Technologies designed, built, qualified and delivered meter-scale structural radiator panels embedded with the OHP technology to address the mission’s unique thermal-mechanical requirements. These variable-thickness, meter-scale OHP radiators acquire, spread and dissipate waste heat from the rover’s multiple navigation and science payloads. 

The customer down-selected ThermAvant Technologies’ OHP-based solution to optimize size, weight, strength, reliability and assembly costs/complexity.   The OHP-based panels’ interface not only with the vehicle and its internal payloads but also with one another to array into a larger 1.7m2 radiator with a high-emissivity coating capable of rejecting >1kW under worst-case, transient conditions.

As part of the qualification and flight program, ThermAvant Technologies manufactured and verified thermal-mechanical performance of the OHP-embedded panels which improved thermal conductance by 6.4x compared to mass-equivalent solid Al panels.  And, the OHP radiators operated reliably  across a range of heat loads, ambient temperatures and gravitational orientations (e.g., ≤1 °C temperature variance when operated in adverse gravity conditions).

Complex OHP Radiator vs. Alternatives

Thermal comparison of aluminum oscillating heat pipe radiator and solid aluminum panel under distributed 20 W to 50 W loads showing superior heat spreading in OHP design.
Aluminum OHP Solid Al
Thermal performance 1 °C per 20 W (e.g., 6 °C / 125 W) 1 °C per 3.7 W
5.4x worse than OHP
Mass 3.2 kg
Al 6061 T4 w. high-e coatings
3.9 g
1.2x worse than OHP
Shape & Structure • Individual panels 800 mm × 350 mm × 3–13 mm (3 mm thinnest OHP section) and designed to array into larger, 1.6 m × 1.1 m radiator with high-e surface coatings
• Al OHP typ. has 5% less stiffness and 5% higher modal frequencies than solid Al
Temperature range -55 °C up to +70 °C
Heritage or maturity-level • <10 OHP lunar rover radiator panels qualified and delivered for launch and >1,000 spacecraft OHPs on-orbit as of mid-2025
• Qualified thru MIL-STD vacuum chamber testing, thermal cycling, vibration, shock and pressure cycling for both launch and lunar surface reliability but not yet deployed on lunar surface as of mid-2025

Flight-Proven Performance

Albedo and ThermAvant successfully designed and completed the world’s first OHP-based thermal control system for very low earth orbit mid-size satellites, where OHPs conduct heat from multiple payloads through 3D transporters and reject across meter-scale radiators.

The result: a 30% mass reduction and 70% volume savings over legacy thermal systems.

Albedo satellite in low Earth orbit using oscillating heat pipe thermal control system co-developed with ThermAvant.

OHP Radiator Tech Specs

Design flexibility and SWaP-C optimization without compromise.

Engineer handling cryogenic fluid transfer in thermal R&D lab with vapor cloud under fluid processing sign

OHP Radiator FAQs

Three-part image showing the full lifecycle of oscillating heat pipe development: thermal design modeling on whiteboard, precision lab testing with instrumentation, and vacuum chamber used for high-fidelity thermal validation.

You Bring the Mission.
We Bring the Solution.

Product Development. Manufacturing. Testing.

From concept to final delivery, ThermAvant partners with your team to design and manufacture OHP-embedded solutions that meet the exact needs of your system.

We support every step:

  • Collaborative design and modeling based on your layout and power profile

  • In-house prototyping (in-house brazing and CNC machining capabilities)

  • On-site lab facilities with high fidelity thermal verification testing

  • Precision manufacturing for high-volume delivery with robust demand schedules