The Kirtland Air Force Base Newspaper recently wrote an article about oscillating heat pipe systems and noted ThermAvant Technologies™ as a leader in the industry. This heat-management technology is cutting edge that will hopefully enter commercial systems soon. Learn more about what other leaders in the industry are doing.
Passive-Solid State Power Amplifier Thermal Management
ThermAvant's proposal for Passive Solid-State Power Amplifier Thermal Management submitted under SBIR Topic Number AF161-086 has been selected for award by the Department of Defense and the Air Force Research Laboratory. The pending award aims to develop low-cost, low-mass thermal management solutions to address the high heat flux and temperature of next generation GaN power amplifiers or phased arrays. The proposed heat transfer technology will have use aboard DoD satellites and be equally applicable for use on commercial satellites, as well as many other terrestrial electronics.
Lightweight Heat Exchangers for Man-Portable Battery Recharging System
ThermAvant's Phase I proposal, entitled “Development of Lightweight Heat Exchangers for Man-Portable Battery Recharging System” submitted to the Army Small Business Innovation Research (SBIR) Program has been competitively selected for negotiation and possible award.
ThermAvant aims to develop and demonstrate compact, lightweight, and ultra-low thermal resistance air-cooled heat exchanger(s) for man-portable thermoelectric battery recharging systems. This research effort intends to not only prove prototypes' outstanding thermal performance prototypes but also result in designs for easy transport, high durability, and low-cost, high-volume manufacture. While the initial application is for charging hand-held thermoelectrics, the to-be-proven innovations can be applied to industrial waste heat systems, solar thermal power generation, vehicle electronics thermal management, and even the cooling of satellite payloads.
Advanced Heat Spreader Technology for GaN MMICs
ThermAvant's Phase I SBIR proposal entitled "Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)" has been notified of its successful offer.
In this pending Phase I effort, ThermAvant aims to design, fabricate and empirically demonstrate high-thermal conductivity heat spreaders for thermal management of high power GaN Power Amplifiers (PAs) on advanced Navy platforms. Innovations to be designed and tested include miniaturization of two-phase heat spreader geometries and the ability to manufacture such heat spreaders at required sizes and materials to survive extreme temperatures required by major defense contractors’ PA assembly processes. For agencies and major defense contractors, this Phase I has the potential to add a new technology to use in removing the thermal constraints facing their radar, Electronic Warfare (EW), and commercial radar/RF systems.